SEMICONDUCTOR CHIP, PRINTED CIRCUIT BOARD, MULTI-CHIP PACKAGE INCLUDING THE SEMICONDUCTOR CHIP AND PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

摘要

A multi-chip package may include a plurality of semiconductor chips and a printed circuit board (PCB). Each of the semiconductor chips may have an upper surface, a bottom surface, and a plurality of side surfaces. Circuit terminals may be arranged on the upper surface. A plurality of side bonding pads may be arranged on one or more selected side surface among the side surfaces. The semiconductor chips may be mounted on the PCB. The PCB may be configured to surround the selected side surface on which the side bonding pads may be arranged.