首页> 外国专利> PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP PACKAGE USING SAME

PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP PACKAGE USING SAME

机译：用于半导体芯片封装的印刷电路板，半导体芯片封装以及使用相同电路板制造半导体芯片封装的方法

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摘要

The present invention relates to a printed circuit board for a semiconductor chip package, a semiconductor package using the same, and a manufacturing method of the semiconductor chip package, wherein the printed circuit board includes a through hole formed through the whole printed circuit board in a thickness direction in order to prevent the printed circuit board from being bent during thermal processing.;COPYRIGHT KIPO 2014

机译：本发明涉及一种用于半导体芯片封装的印刷电路板，使用该印刷电路板的半导体封装以及该半导体芯片封装的制造方法，其中，印刷电路板包括贯穿整个印刷电路板形成的通孔。厚度方向以防止印刷电路板在热处理过程中弯曲。; COPYRIGHT KIPO 2014

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公开/公告号KR20140030903A

专利类型
公开/公告日2014-03-12

原文格式PDF
申请/专利权人 STS SEMICONDUCTOR & TELECOMMUNICATIONS CO. LTD.;
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申请/专利号KR20120097651
发明设计人 JEONG BYEONG HO;
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申请日2012-09-04
分类号H01L23/12;H05K3/34;H05K3/40;
国家 KR
入库时间 2022-08-21 15:43:29

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