首页> 外国专利> METHOD OF MANUFACTURING A PACKAGE, A LIGHT GENERATING DEVICE AND A METHOD OF MANUFACTURING A LIGHT GENERATING DEVICE BY USING THE SAME, CAPABLE OF IMPROVING RELIABILITY DETERIORATION

METHOD OF MANUFACTURING A PACKAGE, A LIGHT GENERATING DEVICE AND A METHOD OF MANUFACTURING A LIGHT GENERATING DEVICE BY USING THE SAME, CAPABLE OF IMPROVING RELIABILITY DETERIORATION

机译:制造包装的方法,光发生装置以及使用相同方法制造光发生装置的方法,能够提高可靠性。

摘要

PURPOSE: A method of manufacturing a package, a light generating device and a method of manufacturing a light generating device by using the same are provided to improve an adhesive force with a sealing material of a lighting-emitting area by forming a lead frame without a metal layer at a reflector.;CONSTITUTION: In a device, a preliminary lead frame is manufactured(S101). The preliminary lead frame is arranged inside the mold to manufacturing a package(S102). An arrangement shape is arranged according to a package. The preliminary package is manufactured(S103). The preliminary package is manufactured through a injection molding by injecting the second binder into the preliminary lead frame. The preliminary package is sintered(S104). Ceramic powder and metal powder are sintered at the same time. The first binder and the second binder are removed through a sintering process.;COPYRIGHT KIPO 2010
机译:目的:提供一种封装的制造方法,一种发光器件以及一种使用该封装的发光器件的制造方法,以通过形成不具有引线框的引线框架来提高与发光区域的密封材料的粘合力。组成:在设备中,制造了初步的引线框架(S101)。初步引线框架被布置在模具内部以制造封装(S102)。根据包装布置布置形状。初步包装被制造(S103)。通过将第二粘合剂注入初步引线框架中,通过注射成型来制造初步包装。初步包装被烧结(S104)。陶瓷粉末和金属粉末同时烧结。第一粘结剂和第二粘结剂通过烧结工艺去除。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090130575A

    专利类型

  • 公开/公告日2009-12-24

    原文格式PDF

  • 申请/专利权人 SEOUL SEMICONDUCTOR CO. LTD.;

    申请/专利号KR20080056275

  • 发明设计人 JEONG CHAN SUNG;HWANG WOONG JOON;

    申请日2008-06-16

  • 分类号H01L33/00;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:50

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