WAFER-LEVEL CAMERA MODULE CAPABLE OF BONDING SUBSTRATES BY ANODIC BONDING AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A wafer-level camera module and a manufacturing method thereof are provided to bond substrates by anodic bonding, thereby accurately obtaining positional error at a wafer level.;CONSTITUTION: An image sensor(10) is placed on the upper side of a wafer. A transparent member(40) is bonded by anodic bonding so that the image sensor is sealed on the wafer. Spacers(50) are bonded with the transparent member by anodic bonding. A wafer lens(60) is bonded in the spacer by anodic bonding.;COPYRIGHT KIPO 2010