SOLDER BALL BUMPING UNIT AND A WAFER BUMPING APPARATUS COMPRISING THE SAME, AND A BUMPING METHOD USING THE SAME, CAPABLE OF PREVENTING A PRODUCT DEFECT

摘要

PURPOSE: A solder ball bumping unit and a wafer bumping apparatus comprising the same are provided to prevent element failure and increase processing efficiency by removing a cause of the contamination of a ball mask in a wafer bumping process.;CONSTITUTION: A bumping unit attaches a solder ball to a plurality of bumping domains defined in the substrate. The solder ball bumping unit comprises a solder ball absorbing unit(140) and a rotating unit. The solder ball absorbing unit comprises a vacuum flow passage and a solder ball mounting groove corresponding to a plurality of the bumping domains. The vacuum flow passage is communicated with the solder ball mounting groove. The rotating unit rotates the solder ball absorbing unit.;COPYRIGHT KIPO 2010