SOLDER BALL BUMPING UNIT COMPRISING ROTATING UNIT AND A WAFER BUMPING APPARATUS COMPRISING THE SAME, AND BUMPING METHOD USING THE SAME, CAPABLE OF AUTOMATICALLY MOUNTING SOLDER BALL

摘要

PURPOSE: A solder ball bumping unit comprising rotating unit and a wafer bumping apparatus comprising the same, and bumping method using the same are provided to improve the accuracy of a work by reducing process time.;CONSTITUTION: A solder ball absorbing body(140) comprises a vacuum plate(141), a first mask(144), and a second mask(147). The vacuum plate has a suck hole(143) for the vacuum pumping. The first mask is combined on the top of the vacuum plate. The first mask comprises at least one concave(145) and the first penetration hole(148). The at least concave groove is formed on the first mask. The first penetration hole provides a vacuum pumping path between the internal space of the concave groove and the suck hole.;COPYRIGHT KIPO 2010