首页> 外国专利> MIM CAPACITOR OF A SEMICONDUCTOR ELEMENT, CAPABLE OF FORMING A MIM STRUCTURE IN A HOLE, AND A FORMING METHOD THEREOF

MIM CAPACITOR OF A SEMICONDUCTOR ELEMENT, CAPABLE OF FORMING A MIM STRUCTURE IN A HOLE, AND A FORMING METHOD THEREOF

机译:能够在孔中形成MIM结构的半导体元件的MIM电容器及其形成方法

摘要

PURPOSE: A MIM(Metal/Insulator/Metal) capacitor of a semiconductor element is provided to improve productivity by forming the structure of a MIM capacitor and following metal layer using a single process, thereby reducing a process.;CONSTITUTION: A first oxide film(200) is formed on a semiconductor substrate. An aluminum layer(202) is formed on the first oxide film. A lower part metal wiring is formed by depositing a mask on the aluminum layer, thereby executing a first etching. A second oxide film(206) is formed in the first oxide film and the front side of the aluminum layer. A hole is formed from the second oxide film to the lower part metal wiring area. A tungsten(204) is gap-filled in the hole as a conductive material.;COPYRIGHT KIPO 2010
机译:用途:提供一种半导体元件的MIM(金属/绝缘体/金属)电容器,通过使用单个工艺形成MIM电容器的结构并跟随金属层,从而减少工艺,从而提高生产率。组成:第一氧化膜(200)形成在半导体衬底上。在第一氧化膜上形成铝层(202)。通过在铝层上沉积掩模来形成下部金属布线,从而执行第一蚀刻。在第一氧化物膜和铝层的前侧中形成第二氧化物膜(206)。从第二氧化物膜到下部金属布线区域形成孔。钨(204)填充在孔中作为导电材料。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100071206A

    专利类型

  • 公开/公告日2010-06-29

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080129839

  • 发明设计人 YUN JONG YONG;

    申请日2008-12-19

  • 分类号H01L27/108;H01L21/8242;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:29

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