BUMP FORMING METHOD CAPABLE OF IMPROVING THE ADHESION RELIABILITY OF A BUMP AND CAPABLE OF REDUCING MANUFACTURING COSTS

摘要

PURPOSE: A bump forming method is provided to reduce manufacturing costs by forming copper included in a semiconductor chip with a transcription process on the surface of a bump and removing a reflow process.;CONSTITUTION: A seed metal layer(120) is formed on a carrier wafer(150). An uneven structure PR pattern(124) is formed on the seed metal layer. A reserve bump(128) is formed in the main part of the PR pattern. The reserve bump of the carrier wafer is attached to a wafer(152). The bump is formed on the wafer by separating the carrier wafer from the wafer.;COPYRIGHT KIPO 2011