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Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test

机译：高温贮存试验中不同凸点下金属（UBm）电镀sn-37pb焊料凸点的可靠性

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Ja-myeong Koo; Dea-gon Kim; Seung-boo Jung;
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年度 2015
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1. Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test [J] . Ja-Myeong Koo, Dea-Gon Kim, Seung-Boo Jung Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2007,第1期

机译：高温存储测试中具有不同凸点下金属化（UBM）的电镀Sn-37Pb焊锡块的可靠性
2. CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength [J] . Se-Young Jang, Wolf J., Ehrmann O., IEEE Transactions on Components and Packaging Technologies . 2003,第1期

机译：基于CrCu的UBM（凸点金属化）研究与电镀Pb / 63Sn焊料凸点-界面反应和凸点剪切强度
3. Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump [J] . Yu-Na Kim, Ja-Myeong Koo, Sun-Kyu Park Journal of Korean Institute of Metal and Materials . 2008,第1期

机译：凸块下金属化（UBM）对电镀纯锡焊料凸块的界面反应和剪切强度的影响
4. Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test [C] . Ja-Myeong Koo, Dea-Gon Kim, Seung-Boo Jung IUMRS International Conference in Asia . 2007

机译：在高温储存测试期间，在凸块金属化（UBMS）下具有不同的电镀SN-37PB焊料凸块的可靠性
5. A novel method for direct solder bump pull testing using lead-free solders [D] . Turner, Gregory Alan 2015

机译：使用无铅焊料进行直接焊料凸点拉力测试的新方法
6. Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points [O] . Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, -1

机译：具有量身定制的转换烙印熔点的电镀多层焊料凸块的流体自组装
7. A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties [O] . Gong JF, Chan PCH, Xiao GW, 2006

机译：基于UBM相关金属间化合物生长特性的电镀和模板印刷倒装焊锡凸块的可靠性比较

Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test

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