Power semiconductor module has base plate, which has assembly surface facing module interior, where power semiconductor circuit is provided with power semiconductor chip on assembly surface

摘要

The power semiconductor module has a base plate (1), which has an assembly surface (11) facing the module interior. A power semiconductor circuit is provided with a power semiconductor chip on the assembly surface. A reinforcing rib (2) is provided for reinforcing the base plate. The reinforcing strip projects through the assembly surface and is formed firmly with the base plate. The reinforcing rib is arranged on the assembly surface of the base plate.