POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES

摘要

A power semiconductor arrangement includes a base plate having a molybdenum layer, and a power semiconductor device mounted to a top side of the base plate and electrically and thermally coupled thereto. The base plate includes a metallic mounting base, which is arranged between the semiconductor device and the molybdenum layer and prevents the molybdenum layer from forming highly resistive intermetallic phases with the semiconductor device. A semiconductor module, such as a power semiconductor module, includes multiple semiconductor arrangements, whereby the base plate of the semiconductor arrangements is a common base plate. A module assembly, such as a power semiconductor module assembly, includes multiple semiconductor modules, whereby the semiconductor modules are arranged side by side to each other with electric connections between adjacent semiconductor modules.