To measure the fatigue ageing of an electronic component in an electronic assembly subjected to mechanical excitations, a dynamic correspondence is established between kinematic measurements at certain points and mechanical stresses experienced at points that are critical as regards the reliability of the electronic assembly, which critical points may different from the measurement points. This correspondence is integrated into a monitoring device as a functionality that calculates the mechanical stresses directly as the value are being delivered by the kinematic sensors. The device also performs numerical processing of the mechanical stresses, thereby providing an indicator of the cumulative fatigue damage. The invention is such that the device can be incorporated into the electronic assembly, it being possible for this device to be autonomous both as regards processing the measurements and calculating the damage.
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