首页> 外国专利> Methods Of Forming Electrically Conductive Lines, Methods Of Forming An Electrically Conductive Buried Line And An Electrical Contact Thereto, Electrically Conductive Lines, And Integrated Circuitry Comprising A Line Of Recessed Access Devices

Methods Of Forming Electrically Conductive Lines, Methods Of Forming An Electrically Conductive Buried Line And An Electrical Contact Thereto, Electrically Conductive Lines, And Integrated Circuitry Comprising A Line Of Recessed Access Devices

机译:形成导电线的方法,形成导电埋线和与其电接触的方法,导电线以及包括一排嵌入式访问设备的集成电路

摘要

A method of forming an electrically conductive buried line and an electrical contact thereto includes forming of a longitudinally elongated conductive line within a trench in substrate material. A longitudinal end part thereof within the trench is of spoon-like shape having a receptacle. The receptacle is filled with conductive material. Insulative material is formed over the conductive material that is within the receptacle. A contact opening is formed over the conductive material that is within the receptacle. Conductor material is formed in the contact opening in electrical connection with the second conductive material that is within the receptacle. Other method and device implementations are disclosed.
机译:形成导电掩埋线及其电接触的方法包括在衬底材料的沟槽内形成纵向细长的导线。其在沟槽内的纵向端部为具有接收器的勺状形状。容器填充有导电材料。在插座内的导电材料上方形成绝缘材料。在插座内的导电材料上方形成接触开口。导体材料形成在接触开口中,并与容器内的第二导电材料电连接。公开了其他方法和设备实现。

著录项

  • 公开/公告号US2011204453A1

    专利类型

  • 公开/公告日2011-08-25

    原文格式PDF

  • 申请/专利权人 BRENT GILGEN;

    申请/专利号US20100710981

  • 发明设计人 BRENT GILGEN;

    申请日2010-02-23

  • 分类号H01L29/78;H01L21/336;H01L23/48;H01L21/768;

  • 国家 US

  • 入库时间 2022-08-21 18:15:13

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