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METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING MODIFIED RECTANGULAR MASK PATTERNS TO INCREASE RELIABILITY OF CONTACTS TO ELECTRICALLY CONDUCTIVE LINES
METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING MODIFIED RECTANGULAR MASK PATTERNS TO INCREASE RELIABILITY OF CONTACTS TO ELECTRICALLY CONDUCTIVE LINES
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机译:使用改进的矩形面罩图案来形成集成电路设备以提高对导电线路的可靠性的方法
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摘要
PURPOSE: A method for manufacturing an integrated circuit device using a modified rectangular mask pattern for increasing the contact reliability of a conductive line is provided to implement high integration with an electrical contact. CONSTITUTION: A first conductive line (112a) and a second conductive line (112b) are located on an integrated circuit board in parallel. The first conductive line and the second conductive line are selectively etched on a pair of electric interconnections with facing ends. The facing ends are defined by using a photolithography mask with a modified rectangular mask pattern. A photoresist pattern (104a) is defined on the integrated circuit board by using the modified rectangular mask pattern. The modified rectangular mask pattern includes a first mask pattern (100) and a second mask pattern (102a,102b) which are rectangular.
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