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Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
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机译:具有堆叠的集成电路和具有开口的散热器的集成电路封装系统及其制造方法
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摘要
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.
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