WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP, A SEMICONDUCTOR PACKAGE HAVING A WIRING SUBSTRATE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE, CAPABLE OF IMPROVING HIGH SPEED OPERATION

摘要

PURPOSE: A wiring substrate for a semiconductor chip, a semiconductor package having a wiring substrate and a method of manufacturing the semiconductor package are provided to prevent the interference between adjacent bonding wires by connecting the bonding wires to first and second bonding pads.;CONSTITUTION: In a wiring substrate for a semiconductor chip, a semiconductor package having a wiring substrate and a method of manufacturing the semiconductor package, a substrate(110) comprises a first side(112) and a second side(114). A windows(180), exposing the chip pad of a semiconductor chip, is formed on the substrate. First and second wiring layers(132,162) are laminated while having at least one insulating layer(122). The first and second bonding pad are connected to the first and second wiring layers respectively and are arranged on one side of the window into an uneven structure.;COPYRIGHT KIPO 2011