FLIP CHIP BONDING METHOD AND STRUCTURE THEREOF CAPABLE OF KEEPING INTERVALS BETWEEN SUBSTRATES UNIFORM

摘要

PURPOSE: A flip chip bonding method and structure thereof are provided to bond a solder bump which has the shortest height using a first resin with first and second electrodes, thereby preventing defective bonding of the solder bump.;CONSTITUTION: A first electrode(12) and a second electrode(32) are formed on a first substrate(10) and a second substrate(30) facing each other. A solder bump(14) is formed between the first electrode and the second electrode. The solder bump electrically connects the first electrode with the second electrode. A space ball(42) keeps the gap between the first substrate and the second substrate. The first substrate and the second substrate are bonded by an underfill layer(40).;COPYRIGHT KIPO 2011