PURPOSE: A vertical LED package with a curvature bottom surface is provided to improve luminous efficiency by suppressing an efficiency droop phenomenon when a high current is injected. ;CONSTITUTION: A structure with a curvature is formed on a package bottom to which a vertical LED is attached. The top of the vertical LED is n-GaN. The bottom of the vertical LED is p-GaN. The vertical LED is bended by the curvature of the bottom if the vertical LED using a metal substrate as a support substrate is die-bonded with the bottom with the curvature. If stress is applied to an LED epitaxial wafer, the band structure of the quantum well layer is changed. A light emitting diode is mounted on the package with Ag based paste or Au-Sn alloy.;COPYRIGHT KIPO 2011
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