SEMICONDUCTOR PACKAGE CAPABLE OF REDUCING THE STRESS OF A MEMS(MICRO ELECTRO MECHANICAL SYSTEMS) CHIP BY PREVENTS A UNDERFILL MATERIAL FROM STAINING ON THE MEMBRANE OF THE MEMS CHIP

摘要

PURPOSE: A semiconductor package is provided to maintain the stacked state between a ASIC(application specific integrate circuit) chip and a MEMS(Micro Electro Mechanical Systems) chip by easily filling a space between the MEMSchip and the ASIC(application specific integrate circuit) chip.;CONSTITUTION: An ASIC(Application Specific Integrate Circuit) chip(12) is attached on a substrate(20). A MEMS chip(10) is laminated and attached on the ASIC chip. A membrane(28) for sensing sound wave is attached to the central part of the MEMS chip. A copper filler(40) grows a internal bonding pad(18) which is formed on the upper circumstance of the ASIC chip(12) at a predetermined height. A protection dam(42) of a ring type is formed in the upper side of ASIC chip. A underfill material(36) fills the intervening space of the copper and is filled into the outer diameter portion of the protection dam.;COPYRIGHT KIPO 2011