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Semiconductor Chips and Systems Having Phase-Change Material (PCM) Switches Integrated with Micro-Electrical-Mechanical Systems (MEMS) and/or Resonators

机译:具有相变材料(PCM)开关与微机电系统(MEMS)和/或谐振器集成在一起的半导体芯片和系统

摘要

A semiconductor chip or system, such as a multi-chip module (MCM), a system-in-package (SiP), and/or a printed circuit board (PCB) module, includes a substrate, a resonator and/or a micro-electrical-mechanical system (MEMS), and a phase-change material (PCM) switch. The PCM switch includes a heating element, a PCM situated over the heating element, and PCM contacts connected to passive segments of the PCM. The heating element is transverse to the PCM and approximately defines an active segment of the PCM. The PCM contacts are electrically connected to the resonator and/or the MEMS in a shared routing region of the semiconductor chip. The PCM switch is configured to engage or disengage the resonator and/or the MEMS. In one approach, a plurality of PCM switches are capable of reconfiguring an array of resonators and/or an array of MEMS. In another approach, a redundant PCM switch is electrically connected to a redundant resonator and/or a redundant MEMS.
机译:半导体芯片或系统,例如多芯片模块(MCM),系统级封装(SiP)和/或印刷电路板(PCB)模块,包括衬底,谐振器和/或微型芯片。 -机电系统(MEMS)和相变材料(PCM)开关。 PCM开关包括加热元件,位于加热元件上方的PCM以及连接至PCM的无源段的PCM触点。加热元件横向于PCM并且大致限定PCM的有效段。 PCM触点在半导体芯片的共享布线区域中电连接到谐振器和/或MEMS。 PCM开关被配置为接合或分离谐振器和/或MEMS。在一种方法中,多个PCM开关能够重新配置谐振器阵列和/或MEMS阵列。在另一种方法中,冗余PCM开关电连接到冗余谐振器和/或冗余MEMS。

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