WAFER POLISHING APPARATUS WHICH IS ARRANGING A WAFER WITH IMPROVED PLANARITY AND A WAFER POLISHING METHOD THEREOF

摘要

PURPOSE: A wafer polishing apparatus and a wafer polishing method thereof are provided to reduce pressure applied to an outer circumference part of a wafer by a second pad using a step difference compensation part, thereby uniformly applying the overall pressure from the second pad on the wafer.;CONSTITUTION: A carrier(300) is arranged on a first pad(120) and includes a wafer accepting groove(310) which is accepting a wafer. A step difference compensation part(400) is projected from the upper surface of the carrier and arranged around the wafer. A second pad(220) is arranged on the carrier and step difference compensation part. A wafer polishing apparatus includes the first pad, the carrier, the step difference compensation part, and the second pad.;COPYRIGHT KIPO 2012