METHOD OF MANAGING POLISHING APPARATUS FOR REDUCING POLISHING IRREGULARITY ON WAFER AND IMPROVING POLISHING ACCURACY

摘要

PURPOSE: A method of managing a polishing apparatus is provided to reduce the polishing irregularity on a wafer and improve the polishing accuracy by monitoring and controlling an actual downforce. CONSTITUTION: A calculation process is performed to calculate a difference between a first downforce detected by a downforce detecting unit at a first period at which a polishing apparatus stands by for polishing a wafer, and a second downforce detected by the downforce detecting unit at a second period at which the polishing apparatus polishes the wafer, as an actual downforce actually applied to the wafer at the second period(ST1). A monitoring process is performed to monitor the actual downforce(ST2,ST3).