METHOD FOR MANUFACTURING A FAN OUT TYPE WAFER LEVEL PACKAGE CAPABLE OF SEPARATING AN ADHESIVE TAPE FROM A CARRIER WITHOUT AN ADDITIONAL PROCESS

摘要

PURPOSE: A method for manufacturing a fan out type wafer level package is provided to secure dimensional stability by forming an adhesive layer which is robust against shear stress.;CONSTITUTION: An auxiliary device(1) laminates and fixes an adhesive tape. A carrier(2) supporting the adhesive tape is located under the auxiliary device. The adhesive tape includes a single structure with a die bonding surface adhesive layer(3) on a base film(4) or a double sided structure with the die bonding surface adhesive layer and a carrier surface adhesive layer(5) on both sides of the base film. The inner diameter of the auxiliary device is larger than the outer diameter of the carrier.;COPYRIGHT KIPO 2012