METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE CAPABLE OF EASILY PERFORMING A WAFER LEVEL PACKAGE WITHOUT A WAFER SUPPORT SYSTEM

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to exclude a separate wire bonding process by electrically connecting a conductive line of a wafer to a conductive pattern of a substrate.;CONSTITUTION: A wafer(10) before back grinding is provided. A trench(14) is formed according to a sawing line of each semiconductor chip of the wafer. A protective film(16) is deposited to an inner part of the trench and a top surface of the semiconductor chip. A conductive line forming hole(18) is formed by removing a part of the protective film. A conductive line(20) is formed by filling a conductive metal inside the conductive line forming hole. A rear surface of the wafer is back-grinded. The sawing process is performed according to the sawing line of the wafer.;COPYRIGHT KIPO 2010