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Anisotropic Conductive Adhesives for UltraSonic Bonding and Electrical Interconnection Method of Electronic Components Using Thereof
Anisotropic Conductive Adhesives for UltraSonic Bonding and Electrical Interconnection Method of Electronic Components Using Thereof
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机译:超声波键合用各向异性导电胶及其电子互连方法
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摘要
The present invention is to provide an anisotropic conductive adhesive (ACA) for ultrasonic wave adhesion, which electrically connects a first electrode, which is an electrode of a connection portion of a first electronic component, with a second electrode, which is an electrode of a connection portion of a second electronic component. The anisotropic conductive adhesive includes an insulating polymer resin, conductive adhesive particles which are melted by heat generated from the ultrasonic waves applied to the anisotropic conductive adhesive, and spacer particles, which have a melting point higher than that of the adhesive particles, and wherein the adhesive particles are melted and made to come in surface contact with at least one electrode selected from the first electrode and the second electrodes, and the first electrode and the second electrode are electrically connected with a constant gap maintained between the first electrode and the second electrode by the spacer particles.
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