cache for wire bonding capillary method and capillary for wire bonding by this query

摘要

present invention the use of microwaves to the capillary tip surface in relief is embossed in the form of concave-convex portion is formed to increase the bonding adhesion, the exchange period relates Rie is capillary for wire bonding elongated Li prepared by this method and for wire bonding capillary. ; capillary for wire bonding method according to the invention alumina (Al ₂ O ₃ ) nickel oxide (NiO) in the solid state reaction of nickel aluminate (NiAl ₂ O ₄ ) to prepare a nickel aluminate prepared; NiAl to prepare a mixed powder of the nickel aluminate (NiAl ₂ O ₄ ) and zirconia (ZrO ₂ ) ₂ O ₄ -ZrO ₂ mixed powder manufacturing steps; The NiAl ₂ O ₄ -ZrO ₂ capping molding the mixed powder by a press-molding step for producing a capillary formed body; The sintering step for producing a capillary sintered body by sintering the capping capillary formed body; May include a microwave irradiation step of forming a concave-convex form of the embossed on at least a part of the tip surface of the capillary sintered by microwave irradiation in the capillary sintered.