PROBLEM TO BE SOLVED: To provide a bonding film-attached substrate for reliably substrates even if they are the ones whose main component is not silicon dioxide (SiO2), or that does not have an Si-group skelton, or when one substrate is bonded with the other substrate whose main component is not silicon dioxide (SiO2) or that does not have an Si-group skelton, and to provide a method of manufacturing the same.;SOLUTION: The bonding film-attached substrate includes: an IR absorption glass member 2 whose main component is not silicon dioxide, or that does not have the Si-group skeleton; a silicon oxide film 6 that is formed on a surface of the IR absorption glass member 2 adjacent to the substrate using a vapor-phase deposition method, and that has a thickness of 100-2,000 nm; and a bonding film 7 provided by plasma polymerization on the silicon oxide film 6.;COPYRIGHT: (C)2012,JPO&INPIT
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