Semiconductor multi-package module including a reversing land grid array package stacked die, so as to cover the ball grid array package

摘要

Multiple package module has the various multiple dice/di which possess various functions. In this execution example, module, includes the digital processor, the analog device, and memory. The first die/di which possesses the relatively large footprint is loaded to on the surface of the first package circuit basis. The second die/di which possesses the footprint which is small to remarkable, is loaded, to on the surface of the first die/di with respect to the second die attachment territory which onto side of one end of the first die/di is. The first die/di is connected electrically by the wire bond to the electric conduction line of die attachment side of the circuit basis. The second die/di being connected electrically by the wire bond to the first package circuit basis, means with to be connected addition by the wire bond to the first die/di. The spacer, with respect to the spacer gluing territory of the surface of the first die/di which is not in the die attachment territory, generally is near the edge of the first die/di, it is loaded to on the first die/di.