SUPPORTING BASE OF PRINTED WIRING BOARD, MANUFACTURING METHOD OF PRINTED WIRING BOARD DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a supporting base which can reduce such a situation as a conduction confirmation part for detecting poor conduction is covered with flux after soldering the terminal wire of an electronic component and the land of a printed wiring board by using a flow solder bath, and to provide a manufacturing method of a printed wiring board device, and the printed wiring board device.;SOLUTION: Flux applied to the backside 16A of a printed wiring board 16 is moved to the downstream side (vertically upward) in the conveyance direction by molten solder jetted from a nozzle. The flux moving to the downstream side in the conveyance direction flows into a flux guide part 34 formed by making the opening edge 30 concave. Consequently, the flux is captured by the flux guide part 34, and a conduction confirmation part and the terminal wire 14 of an electronic component 12 are brought into a state where there is no residual flux.;COPYRIGHT: (C)2012,JPO&INPIT