首页> 外国专利> CONNECTION STRUCTURE OF PRINTED WIRING BOARD, WIRING BOARD CONNECTION BODY, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING WIRING BOARD CONNECTION BODY

CONNECTION STRUCTURE OF PRINTED WIRING BOARD, WIRING BOARD CONNECTION BODY, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING WIRING BOARD CONNECTION BODY

机译:印刷电路板,电路板连接体,电子设备的连接结构和制造电路板连接体的方法

摘要

PROBLEM TO BE SOLVED: To prevent corrosion of a connection electrode when connecting printed wiring boards with each other, or connecting a printed wiring board and an electronic component through an anisotropic conductive adhesive, and to prevent stress or deformation from concentrating on the vicinity of a connection.;SOLUTION: The connection structure of printed wiring board constituted by connecting a printed wiring board 1 and a member 11 to be connected comprises the printed wiring board 1 having a first connection region 5 where a first connection electrode 4a is exposed, and the member 11 to be connected having a second connection region 15 where a second connection electrode 14a is exposed. In a state where the first and second connection electrodes are conducted through an anisotropic conductive adhesive 10, the first and second printed wiring boards are bonded, and the anisotropic conductive adhesive is applied to cover a region at least wider than one connection region.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:在相互连接印刷线路板或通过各向异性导电胶连接印刷线路板和电子元件时,为了防止连接电极腐蚀,并防止应力或变形集中在绝缘层附近。解决方案:通过将印刷线路板1和要连接的构件11连接而构成的印刷线路板的连接结构包括:印刷线路板1具有暴露出第一连接电极4a的第一连接区域5;以及待连接部件11具有第二连接区域15,第二连接电极14a露出。在第一连接电极和第二连接电极通过各向异性导电胶10导通的状态下,将第一印刷线路板和第二印刷线路板粘结,并施加各向异性导电胶以覆盖至少一个连接区域宽的区域。 :(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2011258739A

    专利类型

  • 公开/公告日2011-12-22

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC;

    申请/专利号JP20100131802

  • 发明设计人 UCHIDA YOSHIFUMI;

    申请日2010-06-09

  • 分类号H05K1/14;H05K3/36;H05K3/32;

  • 国家 JP

  • 入库时间 2022-08-21 17:38:42

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