PRINTED WIRING BOARD CONNECTION STRUCTURE, HEAD STACK ASSEMBLY WITH PRINTED WIRING BOARD CONNECTION STRUCTURE, MAGNETIC DISK DEVICE WITH HEAD STACK ASSEMBLY, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board connection structure capable of improving electric and mechanical connection reliability, a head stack assembly with the printed wiring board connection structure, a magnetic disk device with the head stack assembly, and a method for manufacturing the printed circuit board connection structure.;SOLUTION: In a printed wiring board connection structure 1000, a flying lead F provided on a first printed wiring board 321 and an exposing lead E provided on a second printed wiring board 333 are ultrasonic-connected with each other via a metal plating layer M. The exposing lead E is exposed to a recess U formed by opening one part of an insulation layer 333c laminated on a substrate 333a, and the metal plating layer M is formed on a surface of the exposing lead E with thickness larger than depth of the recess U.;COPYRIGHT: (C)2012,JPO&INPIT