Thermal treatment equipment, temperature control manner, production manner and amendment value acquisition mannered null treatment

摘要

PROBLEM TO BE SOLVED: To provide a temperature control method to perform quick, accurate, and error-free soaking control over all wafer areas to be thermally treated at a target temperature without requiring any skilled operator and to be automated by using a computer system.;SOLUTION: In the temperature control method of controlling a heating apparatus having at least two heating zones in such a manner that temperatures detected at predetermined locations equal a target temperature therefor, temperatures are detected at predetermined locations the number of which is larger than the number of the heating zones, and the heating apparatus is controlled in such a manner that the target temperature falls between a maximum value and a minimum value of a plurality of detected temperatures.;COPYRIGHT: (C)2010,JPO&INPIT