首页> 外国专利> COMPATIBLE VERTICAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR TRANSISTOR AND LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR TRANSISTOR AND MANUFACTURE METHOD THEREOF

COMPATIBLE VERTICAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR TRANSISTOR AND LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR TRANSISTOR AND MANUFACTURE METHOD THEREOF

机译:垂直双扩散金属氧化物半导体晶体管和横向双扩散金属氧化物半导体晶体管及其制造方法

摘要

A method for manufacturing compatible vertical double diffused metal oxide semiconductor (VDMOS) transistor and lateral double diffused metal oxide semiconductor (LDMOS) transistor includes: providing a substrate having an LDMOS transistor region and a VDMOS transistor region; forming an N-buried region in the substrate; forming an epitaxial layer on the N-buried layer region; forming isolation regions in the LDMOS transistor region and the VDMOS transistor region; forming a drift region in the LDMOS transistor region; forming gates in the LDMOS transistor region and the VDMOS transistor region; forming PBODY regions in the LDMOS transistor region and the VDMOS transistor region; forming an N-type GRADE region in the LDMOS transistor region; forming an NSINK region in the VDMOS transistor region, where the NSINK region is in contact with the N-buried layer region; forming sources and drains in the LDMOS transistor region and the VDMOS transistor region; and forming a P+ region in the LDMOS transistor region, where the P+ region is in contact with the source.
机译:一种兼容的垂直双扩散金属氧化物半导体(VDMOS)晶体管和横向双扩散金属氧化物半导体(LDMOS)晶体管的制造方法,包括:提供具有LDMOS晶体管区域和VDMOS晶体管区域的基板;在衬底中形成N埋入区;在N埋层区域上形成外延层;在LDMOS晶体管区域和VDMOS晶体管区域中形成隔离区域;在LDMOS晶体管区域中形成漂移区域;在LDMOS晶体管区域和VDMOS晶体管区域中形成栅极;在LDMOS晶体管区域和VDMOS晶体管区域中形成PBODY区域;在LDMOS晶体管区域中形成N型GRADE区域;在VDMOS晶体管区域中形成NSINK区域,其中NSINK区域与N埋层区域接触;在LDMOS晶体管区域和VDMOS晶体管区域中形成源极和漏极;在LDMOS晶体管区域中形成P +区域,其中,P +区域与源极接触。

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