首页> 外国专利> SILICON CARBIDE SUBSTRATE, EPITAXIAL LAYER PROVIDED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE

SILICON CARBIDE SUBSTRATE, EPITAXIAL LAYER PROVIDED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE

机译:碳化硅衬底,外延层提供的衬底,半导体器件和制造碳化硅衬底的方法

摘要

The present invention provides a silicon carbide substrate, an epitaxial layer provided substrate, a semiconductor device, and a method for manufacturing the silicon carbide substrate, each of which achieves reduced on-resistance. The silicon carbide substrate is a silicon carbide substrate having a main surface, and includes: a SiC single-crystal substrate formed in at least a portion of the main surface; and a base member disposed to surround the SiC single-crystal substrate. The base member includes a boundary region and a base region. The boundary region is adjacent to the SiC single-crystal substrate in a direction along the main surface, and has a crystal grain boundary therein. The base region is adjacent to the SiC single-crystal substrate in a direction perpendicular to the main surface, and has an impurity concentration higher than that of the SiC single-crystal substrate.
机译:本发明提供了碳化硅衬底,设置有外延层的衬底,半导体器件以及用于制造碳化硅衬底的方法,它们中的每一个都实现了降低的导通电阻。碳化硅衬底是具有主表面的碳化硅衬底,并且包括:形成在主表面的至少一部分中的SiC单晶衬底;以及形成在主表面上的SiC单晶衬底。设置为包围SiC单晶基板的基底部。基底构件包括边界区域和基底区域。边界区域在沿着主表面的方向上与SiC单晶衬底相邻,并且在其中具有晶粒边界。基部区域在垂直于主表面的方向上与SiC单晶衬底相邻,并且具有高于SiC单晶衬底的杂质浓度的杂质浓度。

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