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HIGH PIN COUNT, SMALL SON/QFN PACKAGES HAVING HEAT-DISSIPATING PAD
HIGH PIN COUNT, SMALL SON/QFN PACKAGES HAVING HEAT-DISSIPATING PAD
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机译:高引脚数,小尺寸SON / QFN封装具有散热垫
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摘要
A plastic SON/QFN package (300) for high power has a pair of oblong metal pins (320, 321) exposed from a surface of the plastic (301), the pins straddling a corner (302) of the package; each pin has a long axis (320a, 321a), the long axes of the pair forming a non-orthogonal angle. Package (300) further includes a chip assembly pad (310), acting as a thermal spreader.
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