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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm
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Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm

机译:使用遗传算法的大规模高引脚数BGA封装的引脚分配优化

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摘要

In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived for signal integrity and power integrity, respectively. A general optimization flow is presented, where the basic concepts of GA optimization are introduced and some important considerations for package design are demonstrated. A customized GA flow and two accelerating strategies are developed to improve the efficiency of the optimization procedure. Using GA optimization, the P/G pin assignment of a BGA package with blocks of core, inputs/outputs and differential pairs can be generated in a few tens of minutes automatically.
机译:本文针对大规模高引脚数球栅阵列(BGA)封装,提出了一种基于遗传算法(GA)的电源/地线(P / G)引脚优化方法。分别得出两个目标函数,分别用于信号完整性和功率完整性。给出了一般的优化流程,其中介绍了GA优化的基本概念,并说明了包装设计的一些重要注意事项。开发了定制的GA流程和两种加速策略以提高优化过程的效率。使用GA优化,可以在几十分钟内自动生成带有内核,输入/输出和差分对模块的BGA封装的P / G引脚分配。

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