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WAFER DICING PRESS AND METHOD AND SEMICONDUCTOR WAFER DICING SYSTEM INCLUDING THE SAME
WAFER DICING PRESS AND METHOD AND SEMICONDUCTOR WAFER DICING SYSTEM INCLUDING THE SAME
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机译:晶圆切块压力机和方法以及包括该晶圆切块方法的半导体晶圆切块系统
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摘要
In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.
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