WAFER LEVEL REFLOW EQUIPMENT FOR A SOLDER BALL AND FLIP CHIP ASSEMBLIES CAPABLE OF IMPROVING THE TEMPERATURE UNIFORMITY OF THE SURFACE OF A WAFER AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: Wafer level reflow equipment for a solder ball and flip chip assemblies and a manufacturing method thereof are provided to improve solder bump yield by regularly maintaining the temperature of a solder bump on a wafer.;CONSTITUTION: A heating chuck(26) is arranged on a support pillar(24). The heating chuck includes a lower part heating plate(26a), a middle heating plate(26b), and a top heating plate(26c). IR(Infrared ray) temperature detection apparatuses(30a, 30b) receive an infrared ray to measure the area temperature of a wafer. The IR temperature detection apparatus regularly maintains the temperature of the solder bump on the wafer. A controller(32) controls the heating output of each heater.;COPYRIGHT KIPO 2012