首页>
外国专利>
MULTI-CHIP PACKAGE APPARATUS WITH A CHIP ADDRESS CIRCUIT CAPABLE OF IMPROVING THE DEGREE OF INTEGRATION
MULTI-CHIP PACKAGE APPARATUS WITH A CHIP ADDRESS CIRCUIT CAPABLE OF IMPROVING THE DEGREE OF INTEGRATION
展开▼
机译:具有芯片地址电路的多芯片封装装置,能够提高集成度
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A multi-chip package apparatus with a chip address circuit is provided to be not affected by lead arrangement not using a lead in which an external ground power supply is applied.;CONSTITUTION: An external power voltage is applied to a lead(310). A pad circuit(320) initializes an inner node to the level of ground power supply. The pad circuit controls the electric potential of the inner node. The pad circuit outputs chip address information. The chip address circuit includes an internal circuit(330). The internal circuit receives the chip address information. The internal circuit uses the chip address information as a chip address.;COPYRIGHT KIPO 2012
展开▼