SEMICONDUCTOR CHIP CAPABLE OF IMPROVING A DEGREE OF INTEGRATION AND A SIGNAL TRANSFER CHARACTERISTIC, AND A THIRD-DIMENSIONAL LAMINATED CHIP AND A THIRD-DIMENSIONAL LAMINATED CHIP PACKAGE

摘要

PURPOSE: A semiconductor chip, a third-dimensional laminated chip and a third-dimensional laminated chip package are provided to increase structural stability and electrical performance of coaxial through silicon via by forming a graphene film between a first via part and an insulation part and between an insulation part and a second via part.;CONSTITUTION: An active layer (130) is formed in one side of a substrate (110). Multiple passive devices (140) are laminated on the other side of substrate. Multiple coaxial through silicone vias (120) are formed through the substrate. The multiple coaxial through silicone vias are electrically connected the passive device and the active layer. The coaxial through silicone via comprises a first via part (121), a second via part (122), and an insulation part (123).;COPYRIGHT KIPO 2013