FILM FOR A FLIP CHIP TYPE SEMICONDUCTOR REAR SIDE CAPABLE OF CONTROLLING AND PREVENTING THE GAMAGE OF A SEMICONDUCTOR DEVICE, A FILM FOR A DICING TAPE INTEGRATED SEMICONDUCTOR REAR SIDE, AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

PURPOSE: A film for a flip chip type semiconductor rear side, a film for a dicing tape integrated semiconductor rear side, and a method for manufacturing a semiconductor device are provided to control the semiconductor device to be bent and to improve manufacturing yield.;CONSTITUTION: A dicing tape(3) comprises a tackifier layer(32) formed on a base material(31). A film(2) for a semiconductor rear side is formed on the tackifier layer. The film for the semiconductor rear side is bigger than a spot corresponding to a semiconductor wafer bonding spot. A semiconductor wafer is attached to the film for the semiconductor rear side. A semiconductor device is formed by dicing the semiconductor wafer. The thickness of the film for the semiconductor rear side is 2μm to 200μm. The thickness of the semiconductor device is 20μm to 300μm.;COPYRIGHT KIPO 2012