WIRE BONDING APPARATUS FOR IMPROVING WIRE BONDING PERFORMANCE OF LED PACKAGE

摘要

PURPOSE: A wire bonding apparatus for improving wire bonding performance of an LED package is provided to improve bonding performance in wire bonding by generating thermal expansion for an original material before the wire bonding. CONSTITUTION: A heater(300) applies heat to a lead frame. The heater is formed in a longitudinal direction on a pre wire bonding area(100) to a wire bonding area(200). A window clamp(400) contacts a lead frame to the heater. The window clamp is composed of a supporting part(440) for the wire bonding and a supporting part(420) for heating. A capillary(500) performs the wire bonding for the lead frame.