A wire bonding method, a semiconductor mounting method using the wire bonding method, a wire bonding apparatus, and a semiconductor mounting apparatus including the wire bonding apparatus.

摘要

PROBLEM TO BE SOLVED: To obtain method and apparatus for mounting a semiconductor in which the connecting failure of bonding or the disconnection of a wire can simply be identified at the time of wire bonding. SOLUTION: The method for mounting a semiconductor including wire bonding and the apparatus for mounting the semiconductor comprise a clamper 5 mounted at a bonding arm 1 and a bonding pressurizing tool 4, and the steps of measuring the tension of a wire 7 held at the clamper 5 after bonding by driving means 3 according to the current flowing to the motor of the means 3, and discriminating between right and wrong of the bonding according to the measured value.