MICRO WIRE FOR AN LED HAVING AN LED DIE PACKAGED IN THE WAFER LEVEL

摘要

PURPOSE: A micro wire for an LED is provided to offer electric connection of the LED having a small form factor while reducing manufacturing time and costs.;CONSTITUTION: A plurality of discrete LED dies(102) is bonded to a substrate. Each discrete LED die comprises an n-doped layer, a quantum well active layer, and a p-doped layer. A parting layer is evaporated on the substrate and the plurality of discrete LED dies. A plurality of via openings is formed by etching the parting layer. An electric wire is formed within the parting layer and the plurality of via openings in order to electrically connecting the substrate with one among the plurality of discrete LED dies. The plurality of discrete LED dies and the substrate are divided into a plurality of LED packages.;COPYRIGHT KIPO 2012