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METHOD FOR INCREASING ETCH SELECTIVITY OF A CARBON FILM WITH A LOWER EXTINCTION COEFFICIENT AND STRESS CAPABLE OF SUPPLYING HIGH TENSILE STRESS
METHOD FOR INCREASING ETCH SELECTIVITY OF A CARBON FILM WITH A LOWER EXTINCTION COEFFICIENT AND STRESS CAPABLE OF SUPPLYING HIGH TENSILE STRESS
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机译:增加低拉伸系数和能够提供高拉伸应力的应力的碳膜的刻蚀选择性的方法
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摘要
PURPOSE: A method for increasing etch selectivity of a carbon film with a lower extinction coefficient and stress is provided to maintain high etch selectivity by securing lower etch rates during the doping of an AHM(ashable hard mask) films.;CONSTITUTION: An evaporation method of a film is as follows. A substrate is arranged in a plasma enhanced CVD(Chemical Vapor Deposition) chamber. A carbon based first AHM layer(10) is coated on the substrate. The substrate is copped with a dopant which is the one of silicon, silane, boron, nitrogen, germanium, carbon, ammonia, or carbon dioxide. The atomic percentage of one or more dopant is higher than 5% of the first AHM alyer.;COPYRIGHT KIPO 2013;[Reference numerals] (10) Coated AHM; (20) Substrate
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