首页> 外国专利> METHOD FOR INCREASING ETCH SELECTIVITY OF A CARBON FILM WITH A LOWER EXTINCTION COEFFICIENT AND STRESS CAPABLE OF SUPPLYING HIGH TENSILE STRESS

METHOD FOR INCREASING ETCH SELECTIVITY OF A CARBON FILM WITH A LOWER EXTINCTION COEFFICIENT AND STRESS CAPABLE OF SUPPLYING HIGH TENSILE STRESS

机译:增加低拉伸系数和能够提供高拉伸应力的应力的碳膜的刻蚀选择性的方法

摘要

PURPOSE: A method for increasing etch selectivity of a carbon film with a lower extinction coefficient and stress is provided to maintain high etch selectivity by securing lower etch rates during the doping of an AHM(ashable hard mask) films.;CONSTITUTION: An evaporation method of a film is as follows. A substrate is arranged in a plasma enhanced CVD(Chemical Vapor Deposition) chamber. A carbon based first AHM layer(10) is coated on the substrate. The substrate is copped with a dopant which is the one of silicon, silane, boron, nitrogen, germanium, carbon, ammonia, or carbon dioxide. The atomic percentage of one or more dopant is higher than 5% of the first AHM alyer.;COPYRIGHT KIPO 2013;[Reference numerals] (10) Coated AHM; (20) Substrate
机译:目的:提供一种增加消光系数和应力较低的碳膜蚀刻选择性的方法,以通过在掺杂AHM(可灰化硬掩模)膜期间确保较低的蚀刻速率来保持较高的蚀刻选择性。构成:蒸发方法电影的内容如下。将衬底布置在等离子体增强的CVD(化学气相沉积)室中。碳基第一AHM层(10)被涂覆在基板上。衬底被掺杂有硅,硅烷,硼,氮,锗,碳,氨或二氧化碳之一的掺杂剂。一种或多种掺杂剂的原子百分比高于第一个AHM合金层的5%。; COPYRIGHT KIPO 2013; [参考数字](10)涂层AHM; (20)基材

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