ELECTROLESS PLATING METHOD INCLUDING A CLEANER PROCESS FOR ELIMINATING FOREIGN MATERIALS STICKING TO A PLATED OBJECT DURING AN INJECTION MOLDING PROCESS

摘要

PURPOSE: An electroless plating method including a cleaner process is provided to enhance adhesion between an object and a copper plated material by removing foreign materials from the object and precisely adjusting the surface of the object.;CONSTITUTION: An electroless plating method comprises a pretreatment process, an electroless copper plating process, a catalyst treatment process, a post treatment process, and a washing and drying process. The pretreatment process comprises a cleaner process, in which an object is dipped in a cleaner treatment liquid of 20-50°C for 30 seconds to 5 minutes and then washed in order to remove foreign materials from the surface of the object, and an ultrasonic degreasing process, in which buff gas is removed from the surface of the object. The cleaner treatment liquid is prepared by mixing 5-10wt.% of sodium bisulfite and 1-5wt.% of H2SO4(Sulfuric Acid) into 85-90wt.% of pure water.;COPYRIGHT KIPO 2012