ANODIC BONDER, ANODIC BONDING METHOD AND METHOD OF MANUFACTURING ACCELERATION SENSOR

摘要

(Tasks) in the anodic bonding apparatus to satisfactorily bond the plurality of substrates that are disposed between the opposed two electrode plates, by applying a stress excessive to the substrate satisfactorily without being bent in a convex shape with respect to the junction surface It provides an anodic bonding apparatus capable of anodic bonding. ; (Solving means), the anodic bonding apparatus of the present invention, the first electrode plate and the second electrode as a ssang the anodic bonding device having an electrode of an arrangement plate to face, and the first electrode plate is a layered substrate is mounted, the first electrode toward the laminate substrate with the box opposite to the plate and characterized by having a second electrode plate having a curved portion which central portion is curved. ; Anodic bonding device, an acceleration sensor