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SCE nanoheterostructures metamorphic InAlAs / InGaAs

机译:SCE变质纳米异质结构InAlAs / InGaAs

摘要

The invention relates to a semiconductor MNEMT (metamorphic high electron mobility transistor) nanogeterostruktur used to manufacture transistors and microwave monolithic integrated circuits with high operating frequency and high breakdown voltages. Object of the present utility model is to increase the operating frequency of the microwave transistors fabricated on the basis nanogeterostruktur high InAs in the active region, grown on GaAs substrates. The technical result, which allows to execute a task, is to reduce the density of dislocations penetrating into the active region nanoheterostructures. Technical result is achieved due to the fact that in the semiconductor metamorphic nanogeterostruktur consisting of a monocrystalline semi-insulating substrate is GaAs (1) superlattice Al 0.4 Ga 0.6 As / GaAs (2), metamorphic buffer In x Al 1-x As (3) with a linear increase in the content InAs x thickness (x = x 1 → x 4, where x 1 = 0, x 4 ≥0.75), depletion region In x Al 1-x As (4) with a smooth or abrupt decrease in the content of InAs x thickness (x = 4 x 4 → x ', where x 4' -x 4 = 0.05 ÷ 0.1), with heal layer of uniform composition In x4 'Al1-x4' As (5), the active region of InAlAs / InGaAs (6) with a high content of InAs (70%) Comp -consistency of the lattice parameter with heals layer inside metamorphic buffer (3) are introduced two mechanically strained superlattice In (x 2+ Δx) Al 1- (x2 + Δx) As / In (x2-Δx) Ga 1- (x2-Δx) As and in (x3 + Δx) Al 1- (x3 + Δx) As / in (x3-Δx) Ga 1- (x3-Δx) As, symmetrically on mismatched Δh = 0.05 ÷ 0.10 relative to the current composition of the metamorphic buffer data points that divide the metamorphic buffer into three parts, each of which content InAs x thickness increases, respectively, from x 1 to x 3, from x 2 and x 3 and of x 3 and x 4, where 0.4 x 2 0.6, and 0.6 x 3 0.75.
机译:本发明涉及用于制造具有高工作频率和高击穿电压的晶体管和微波单片集成电路的半导体MNEMT(变质高电子迁移率晶体管)纳米结构。本实用新型的目的是增加在GaAs衬底上生长的,基于在有源区中的高InAs纳米结构制造的微波晶体管的工作频率。允许执行任务的技术结果是降低渗透到有源区纳米异质结构中的位错的密度。由于在由单晶半绝缘衬底组成的半导体变质纳米结构中,GaAs(1)超晶格Al 0.4 Ga 0.6 As / GaAs( 2),变质缓冲区In x Al 1-x As(3),InAs x的含量线性增加(x = x 1 →x 4,其中x 1 = 0,x 4 ≥0.75),耗尽区位于 x Al 1-x As(4),InAs x厚度的含量平滑或突然降低(x = 4 x 4 →x' ,其中x 4' -x 4 = 0.05÷0.1),愈合层的成分均匀,位于 x4'Al 1- x4' As(5)引入了InAlAs / InGaAs(6)的有效区域,其中InAs含量高(70%)Comp-晶格参数与变质缓冲区(3)内的愈合层的一致性机械应变超晶格In(x 2 +Δx)Al 1-(x2 + Δx)As / In(x2-Δx)Ga 1-(x2-Δx)As和 in(x3 +Δx)Al 1- (x3 + Δx)As / in(x3-Δx)Ga 1-(x3-Δx)As对称于不匹配的Δh= 0.05÷0.10(相对于将变态缓冲区分为三部分的变态缓冲区数据点的当前组成) InAs x厚度的含量分别从x 1 增加到x 3,x 2 和x 3 增加和x 3 和x 4,,其中0.4 2 <0.6和0.6 3 < 0.75。

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