Semiconductor device, has electrical connection of intermediate elements provided between support plate and chip and connected to electrical interconnection unit of plate and rear electrical interconnection network of chip

摘要

The device (1) has an electrical connection support plate (2), and an integrated circuit chip (8). A rear electrical interconnection network (13) is provided with a through-vias electrical connection (5) for connecting the rear electrical interconnection network with a front electrical interconnection network (14). An electrical connection of intermediate elements (17) is provided between the support plate and the integrated circuit chip, and connected to an electrical interconnection unit (4) of the plate and the rear electrical interconnection network of the chip.