Semiconductor device, has main chip and secondary chip electrically connected to connection unit using electrical connection wires respectively, and encapsulation unit for covering chips and connection wires

摘要

The device (1) has a multilayer support plate (2) comprising an electrical connection unit (3), and a main chip (8) mounted on a front surface (7) of the plate. A secondary chip (12) is fixed on a front surface (11) of the main chip and is sensible to the temperature. The main chip and secondary chip are electrically connected to the connection unit using electrical connection wires (9, 13) respectively. An encapsulation unit (16) covers the chips and connection wires.